Principals

PVA TePla AG develops, assembles, and markets plasma systems for the semiconductor and printed circuit board industries, covering both front-end and back-end processes. Their solutions include high-capacity, damage-free resist stripping and wafer cleaning, monitoring ion implantation doses, and stress analysis for wafers. They also provide advanced chip package cleaning before die-attachment, wire bonding, and encapsulation. Additionally, they offer desmearing and etchback processes for multilayer PCBs, flex-rigid PCBs, and flexboards.

YizTech Co., Ltd., founded in 1996 in Taiwan, specializes in microwave absorbers and epoxy adhesives for various industries. With advanced R&D labs, the company develops reliable, cost-effective solutions tailored to customer needs, focusing on partnerships and problem-solving.

Teca-Print AG is an independent, multinational enterprise and aim to take a leading role in pad print machine construction, accessories and tooling.

Musashi Engineering offers a rich and varied lineup of everything from fully automated and specialized dispensing equipment to dispensing heads, controllers, and desktop robots, as well as parts such as nozzles and syringes to match your various dispensing scenarios.

Thermocarbon Inc., founded in 1978, specializes in diamond dicing blades like Dicemaster® and Blademaster®. With over 40 years of experience, they provide R&D, blade samples, and fast delivery, often within 24 hours for emergencies. Thermocarbon is dedicated to optimizing dicing processes and offering custom solutions, earning recognition such as Corning’s "Most Valued Partner" award.

Solarius is a global leader in non-contact surface inspection, offering innovative metrology systems for industries like microelectronics and semiconductors. Established in 2000 in Silicon Valley, it has expanded worldwide, providing over 2,000 systems focused on precision and quality.

Leadlap Semiconductor, dedicated to the research, production, and sales of Dicing, Grinding, and Polishing equipment for semiconductors and related consumables. Our primary focus encompasses advanced packaging laser solutions, thinning machines, CMP equipment, and other precision processing tools for semiconductors. We provide high-end semiconductor equipment and services to clients worldwide.” Products are Back-Grinding, Laser Grooving and Full Cut, Laser Ring cutting and Automatic Ring Removal, Wafer Backside Marking, & Stealth Dicing.

M-FINE Technology (Shanghai) Co., Ltd. established in September 2012 in Shanghai. The company obtained ISO9001 and ISO14000 certification in 2019, National High-Tech Enterprise certification in 2020, and the Shanghai Science and Technology Little Giant Project in 2021. Products are High-end Semiconductor Oven (All series of curing & baking related products), Wafer & Leadframe Taping Equipment (Fully Auto Tape Laminator, Wafer Mounter, Tape Remover, Wafer De-Mounter, etc), Advanced packaging Molding systems, Mold chase & conversion kits.