Keteca Diamaflow™ Dicing Solutions & Surfactants
Key Benefits
Prevents cut debris build up on bonding pads by reducing the surface tension
Removes silicon dust from the cut area by encapsulating the individual particle and suspend any contamination so it floats off the wafer surface
Prevents corrosion of bonding pads and bumps
Improves ball shear strength
Reduces heat and friction during dicing
Reduces wafer chipping and cracking
Reduces damage from electrostatic discharge (ESD)
Keeps the dicing blade cleaner, prolonging the cutting life of the dicing blade
Keeps dicing saws clean
Environmentally safe and friendly, non-toxic
Effectiveness of Keteca Diamaflow™
Incoming Wafer
No Diamaflow™
With Diamaflow™
Diagram A: The water molecules, due to high surface tension, stay on the top of the wafer and do not reach the cutting line. This leads to cut debris sticking onto the wafer and blade surface, causing issues such as chipping, internal cracking, and local high heat areas.
Diagram B: Diamaflow™ dicing solutions effectively reduce the surface tension of the D.I. water, allowing water to penetrate the depth of the cut line. This flows off the debris and keeps the cutting area cool.